| 年度 | 主要実績 |
|---|---|
| 2017〜 | Developing next generation products, such as substrates for Automotive, e-Cavity, SUTC, etc. |
| 2016 | Developed ETPS substrate Developed ≥10L multi-layer coreless substrate Developed SIMS product for AP Developed RtMLF substrate Embedded Trace Substrate (ETS) selected as world's top quality product |
| 2015 | Developed world's first substrate with resin-based etchable SR Developed 5L Coreless substrate Developed and commercialized world's first Wire Bonding ETS subtrate Developed Cavity BGA board |
| 2014 | Developed FC-CSP board for SSD Controller |
| 2013 | Commercialized world's first ETS substrate Developed FC-CSP board embedded with ETS technology |
| 2012 | Developed 3L Coreless board |
| 2011 | Developed Embedded board (EAD, EPD) |
| 2009 | Developed 10 layer FMC & LCD substrate by using B2it Method Developed Resistor-embedded Package Substrate |
| 2008 | Developed Flip Chip GDDR5 1G product Developed Ultra Thin CSP product Memory module and BOC substrates selected as world's top quality products |
| 2007 | Developed Flip Chip GDDR4 512M product Developed MCP product |
| 2006 | Established SIMMTECH R&D Center Set up Flip Chip related facilities and developed its technology ( MSAP, SOP, Via Filling, etc.) |
| 2004 | Developed and acquired BOC product Slot processing technology of its own |
| 2003 | Proceeded Starlight Project Joint-Development with Singapore STATS Corp. Signed Technology management agreement with Japan DNP Corp. for B2it Method Developed FMC (Flash Memory Card) product |
| 2001 | Signed Joint-development agreement with CMK Corp. for developing next build-up flip chip BGA Signed agreement with Tessera Corp. for developing Wire-bonded uBGA Package Substrate |
| 2000 | Proceeded the advanced DRAM PCB Co-work with Rambus Corp. Strategic technical co-operation with CMK Corp. to develop next-generation PCB |
| 1993 | Established company annex SIMMTECH R&D Center |
| 1990 | Succeded to develop SIMM PCB of its own |